2026 International Conference on Machine Vision, Detection and 3D Imaging Technology
        
                        
                2026 International Conference on Machine Vision, Detection and 3D Imaging Technology
2026 International Conference on Machine Vision, Detection and 3D Imaging Technology will be held on May 19-21, 2026.
Against the deep convergence of AI and smart manufacturing, machine vision, detection, and 3D imaging technologies have become core enablers, driving the global 3D vision market to reach USD 15 billion by 2025 with a 20% CAGR and penetrating sectors like consumer electronics and semiconductors.
Facing challenges in scene robustness, multi-camera collaboration, and data mining—alongside new directions from embodied intelligence and deep learning integration—MVDIT 2026 is launched to build a high-end platform for global experts to address industry bottlenecks and explore technological evolution.
The opening date for paper submissions dates: 19 February 2026
The closing date for paper submissions dates: 1 April 2026
Notification of acceptance or rejection date: 15 working days after the submission
Final paper submission date: 19 April 2026
Conference Date: May 19-21, 2026
MVDIT 2026 is the premier interdisciplinary platform for the presentation of new advances and research results in the fields of Machine Vision, Detection and 3D Imaging Technology. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. Topics of interest for submission are as followed:
Machine Vision Perception and Cognitive Computing
Image/Video Analysis and Intelligent Recognition
Application of Deep Learning in the Field of Vision
Multimodal Sensor Fusion Detection Technology
Industrial and Civil Scene Detection Systems
Core Methods of 3D Reconstruction and Modeling
Computational Imaging and 3D Optical Technology
RGBD/Point Cloud Data Processing
Visual Imaging Hardware and System Optimization
Cross-Domain Applications of Vision Technology
Sponsor

Nanchang Hangkong University
Organizer

Nanchang Hangkong University, SCHOOL OF INSTRUMENT SCIENCE AND OPTOELECTRONIC ENGINEERING
Co-organizer

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